Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
This is an interdisciplinary tutorial designed for electrical, mechanical, chemical, and materials engineers working in the electronic packaging fields. Each chapter covers a major packaging technology according to a master gird, so all chapters follow an identical format. Each chapter includes schematics and block diagrams, problems and solutions, and details the impact of each technology on electrical, materials, chemical, and mechanical tracks.